Aluminum Base PCB (PCB-03 Aluminium Gold Plating)

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Aluminum Base PCB (PCB-03 Aluminium Gold Plating)

Model: PCB-03 Aluminium Gold Plating
Trademark: ZAPON
Origin: China

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It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc. The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-A, And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc. Thickness of the copper: 18um, 35um, 70um, 105um.

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About

ZAPON GROUP is a well-known group specializing in the produce and sale PCB and PCBA.Has two PCB factories , one SMT factory and one Trade company .

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Factory 1
www.pcbzapon.com
Factory 2
www.pcb-dj.com

Item	Test item				Technology request	Unit	Test result
1	Peel Strength		A		≥ 1.0	N/mm	1.05
1	Peel Strength		After thermal stress (260 ordm;C )		≥ 1.0	N/mm	1.05
2	Blister test AfterThermal stress (288 ordm;C, 2min)				288ordm;C 2 min No delaminating	/	OK
3	Themal Resistance				≤ 2.0	ordm;C /W	0.65
4	Flammability(A)				FV-O	/	FV-O
5	Surface Resistivity	A			≥ 1 × 10 5	M Ω	5.0 × 10 7
5	Surface Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 5	M Ω	4.5 × 10 6
6 7	Volume Resistivity	A			≥ 1 × 10 6	M Ω· m	1.0 × 10 8
6 7	Volume Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 6	M Ω· m	1.9 × 10 7
8	Dielectric Breakdown (DC )				≥ 25	Kv/mm	31
9	Dielectric constant (1MHz) (40 ordm;C, 93% , 96h)				≤ 4.4	/	4.2
10	Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h)				≤ 0.03	/	0.029
	Accelerated aging experiment (125 ordm;C ,2000h)				The laminate bace should no wrinkles,no crack,no delaminating or no pine	/	OK
11	High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation)			Peel Strength	/	N/mm	1.39 ~ 1.64
11				Surface Resistivity	/	M Ω	1.9 × 10 8 ~6.4 × 10 8

Item	Test item				Technology request	Unit	Test result
1	Peel Strength		A		≥ 1.0	N/mm	1.05
1	Peel Strength		After thermal stress (260 ordm;C )		≥ 1.0	N/mm	1.05
2	Blister test AfterThermal stress (288 ordm;C, 2min)				288ordm;C 2 min No delaminating	/	OK
3	Themal Resistance				≤ 2.0	ordm;C /W	0.65
4	Flammability(A)				FV-O	/	FV-O
5	Surface Resistivity	A			≥ 1 × 10 5	M Ω	5.0 × 10 7
5	Surface Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 5	M Ω	4.5 × 10 6
6 7	Volume Resistivity	A			≥ 1 × 10 6	M Ω· m	1.0 × 10 8
6 7	Volume Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 6	M Ω· m	1.9 × 10 7
8	Dielectric Breakdown (DC )				≥ 25	Kv/mm	31
9	Dielectric constant (1MHz) (40 ordm;C, 93% , 96h)				≤ 4.4	/	4.2
10	Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h)				≤ 0.03	/	0.029
	Accelerated aging experiment (125 ordm;C ,2000h)				The laminate bace should no wrinkles,no crack,no delaminating or no pine	/	OK
11	High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation)			Peel Strength	/	N/mm	1.39 ~ 1.64
11				Surface Resistivity	/	M Ω	1.9 × 10 8 ~6.4 × 10 8