| NO. | ITEM | PARAMETERS |
| 1 | Surface Finish | HAL、HAL leadfree、Gold Plating、OSP、Immersion gold、Immersion Silver、Immersion Sn and Gold Finger |
| 2 | Layers | 1~16 Layers |
| 3 | Base Material | FR-4(High Tg,Halogen Free), CEM-1, CEM-3,Rogers |
| 4 | Finished Copper Weight | 17um-140um |
| 5 | Min Line Width/Space | 0.1mm/0.1mm ( 4mil / 4mil ) |
| 6 | Min Finished Hole Size | 0.2mm(8mil) |
| 7 | NPTH Hole Dia.Tolerance | ±0.05mm(2mil) |
| 8 | PTH Hole Dia.Tolerance | ±0.075mm(3mil) |
| 9 | Hole Plating Thickness | ≥20um |
| 10 | Max Panel Size | 500mm X 1200mm |
| 11 | Outline Tolerance | ±0.127mm(5mil) |
| 12 | Thickness | 0.2~3.2mm |
| 13 | Thickness Tolerance (≥0.8mm) | ±8% |
| 14 | Thickness of Min. Mask | 10um |
| 15 | Solder Mask | Green, Yellow, Black, Blue, Red, Peelable mask |
| 16 | Min. String Width | 0.2mm(8 mil) |
| 17 | Max. String Width | 0.8mm(32 mil) |
| 18 | Silkscreen Color | Green, Yellow, Black, Blue, Red |
| 19 | File format | Gerber file, CAM350, Protel, PowerPCB |
| 20 | E-TEST | Flying Prob, E-test, Fixture |
| 21 | Other Test | Impedance, Slice up |
| 22 | Warp & Twist | ≤0.7% |
| No. | Item | Capabilities |
| 1 | Layers | 1-2 Layers |
| 2 | Finished Thickness | 16-134mil (0.4mm-3.4mm ) |
| 3 | Max. Dimension | 500mm *1200mm |
| 4 | Material | TCB-2AL,CS-AL-88/89,EM-MP,HA80,NRK,JHAF02-1.0,3D Bending,Copper base |
| 5 | Finished Thickness Tolerance | ≤1.0mm ±0.10mm 1.6mm ±0.15mm |
| 6 | Min.Line Width&Spacing | 4mil (0.1mm ) |
| 7 | Copper Thickness | 35um, 70um,1 to 10oZ |
| 8 | Min. Finished Hole Size | 0.95mm |
| 9 | Min. Drill Size | 1.00mm |
| 10 | Max. Drill Size | 6.5mm |
| 11 | Finished Hole Size Tolerance | ±0.050mm |
| 12 | Aperture Position Precision | ±0.076mm |
| 13 | Warp & Twist | 0.75% |
| 14 | Min SMT PAD Size | 0.4mm±0.1mm |
| 15 | Min.Solder Mask PAD | 0.05mm(2mil) |
| 16 | Min.Solder Mask Cover | 0.05mm(2mil) |
| 17 | Solder mask Thickness | >12um |
| 18 | Min.Solder Mask Bridge | 0.1mm（4mil) |
| 19 | Surface Finishing | HAL, HAL Leadfree,OSP, Immersion Gold, etc |
| 20 | HAL Thickness | 5-12um |
| 21 | Immersion Gold Thickness | 1-3 Microinch |
| 22 | OSP Film Thickness | ENTEK PLUS HT:0.3-0.5um; F2:0.15-0.3um |
| 23 | V-CUT Angle | 30°,45°,60° |
| 24 | V-CUT Thickness | 0.4-3.4mm |
| 25 | V-CUT Precision | ±0.05mm, Up&Down Cut Deviation ±0.05mm,Residual Thickness ±0.05MM |
| 26 | Outline Finishing | Routing & Punching; Precision Deviation ±0.10mm |
| 27 | E-test Voltage | 250 ± 5V |
| 28 | E-test Resistance | 10Ω-100MΩ |
| 29 | Peel Strength | 288°, 30s ≥1.4 |
| 30 | Thermal Conductivity | 1.0 to 12w/m.k |
| 31 | Withstand Voltage | AC:1KV to 6.5KV, DC:1KV to 8.5KV |
| 32 | Thermal Stress | 288°,30s Non-Layered No Foaming |