Item | Capabilities | ||
Number of Layers | Single side | ||
Material | CEM-1,FR-2,FR-1,FR-4,XPC-94HB | ||
PCB Thickness | Min.thickness | 0.8mm(32mil) | |
Max.thickness | 1.6mm(63mil) | ||
Surface finished | Flux | ||
Nickel Plating | |||
Gold Plating | |||
Hot Air Solder Leveling(HASL) | |||
Entek Coating (OSP) | |||
Solder Mask | Green,White,Black,Yellow,Red,Blue | ||
Other printing | Silver through hole | ||
Carbon Print, Peelable Mask | |||
Carbon Through Hole | |||
Copper thickness | 1/2 oZ(18 μm) - 1 oZ (35 μm) | ||
Min. Hole Size | CNC-Drilled | 0.4mm (16 mil) | |
Punched | 0.8mm (32 mil) | ||
Hole Size Tolerance (CNC Drilled) | +/ -0.076mm (3 mil) | ||
Hole Size Tolerance (Punched) | +/ -0.1mm (4 mil) | ||
Min. Line Width and Spacing | 0.2mm (8 mil) | ||
Min. Solder Mask Clearance (UV Cure) | 0.15mm (6 mil) | ||
Min. Solder Mask Clearance (Thermal Cure) | 0.1mm (4 mil) | ||
Min. Annular Ring | 0.15mm (6mil) | ||
Profile and V-Cut | Stamping, V-Cut and Beveling,CNC |
Item | Capabilities | ||
Number of Layers | Single side | ||
Material | CEM-1,FR-2,FR-1,FR-4,XPC-94HB | ||
PCB Thickness | Min.thickness | 0.8mm(32mil) | |
Max.thickness | 1.6mm(63mil) | ||
Surface finished | Flux | ||
Nickel Plating | |||
Gold Plating | |||
Hot Air Solder Leveling(HASL) | |||
Entek Coating (OSP) | |||
Solder Mask | Green,White,Black,Yellow,Red,Blue | ||
Other printing | Silver through hole | ||
Carbon Print, Peelable Mask | |||
Carbon Through Hole | |||
Copper thickness | 1/2 oZ(18 μm) - 1 oZ (35 μm) | ||
Min. Hole Size | CNC-Drilled | 0.4mm (16 mil) | |
Punched | 0.8mm (32 mil) | ||
Hole Size Tolerance (CNC Drilled) | +/ -0.076mm (3 mil) | ||
Hole Size Tolerance (Punched) | +/ -0.1mm (4 mil) | ||
Min. Line Width and Spacing | 0.2mm (8 mil) | ||
Min. Solder Mask Clearance (UV Cure) | 0.15mm (6 mil) | ||
Min. Solder Mask Clearance (Thermal Cure) | 0.1mm (4 mil) | ||
Min. Annular Ring | 0.15mm (6mil) | ||
Profile and V-Cut | Stamping, V-Cut and Beveling,CNC |