Quantity: | |
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Item | Capabilities | |
Number of Layers | Double Side | |
Material | FR-4,CEM-3,HighTg, Aluminum, Halogen Free | |
PCB Thickness | Min.thickness | 0.2mm(8mil) |
Max.thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
Immersion Gold(Silver) | ||
HAL Lead Free | ||
Hot Air Solder Leveling(HASL) | ||
Entek Coating (OSP) | ||
Solder Mask | Green,White,Black,Yellow,Red,Blue | |
Other printing | Gold Finger | |
Carbon Print, Peelable Mask | ||
Solder Mask Plugged Hole | ||
Copper thickness | 1/ 2 oz (18 μm) - 4 oz (140 μm) | |
Min. Finished Hole Size | 0.3mm(12mil) | |
Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
Min. Line Width and Spacing | 0.10mm (4 mil) | |
Min. Solder Mask Clearance | 0.076mm (3 mil) | |
Min. Annular Ring | 0.1mm (4mil) | |
Profile and V-Cut | CNC-Routing, Stamping and Beveling,V-CUT,CNC | |
Special Process | Micro-section, Chamfer for Gold Finger |
Item | Capabilities | |
Number of Layers | Double Side | |
Material | FR-4,CEM-3,HighTg, Aluminum, Halogen Free | |
PCB Thickness | Min.thickness | 0.2mm(8mil) |
Max.thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
Immersion Gold(Silver) | ||
HAL Lead Free | ||
Hot Air Solder Leveling(HASL) | ||
Entek Coating (OSP) | ||
Solder Mask | Green,White,Black,Yellow,Red,Blue | |
Other printing | Gold Finger | |
Carbon Print, Peelable Mask | ||
Solder Mask Plugged Hole | ||
Copper thickness | 1/ 2 oz (18 μm) - 4 oz (140 μm) | |
Min. Finished Hole Size | 0.3mm(12mil) | |
Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
Min. Line Width and Spacing | 0.10mm (4 mil) | |
Min. Solder Mask Clearance | 0.076mm (3 mil) | |
Min. Annular Ring | 0.1mm (4mil) | |
Profile and V-Cut | CNC-Routing, Stamping and Beveling,V-CUT,CNC | |
Special Process | Micro-section, Chamfer for Gold Finger |