Quantity: | |
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Item | Capabilities | |
Number of Layers | From 4-layer to 22- Layer | |
Material | FR-4, HighTg, Rogers Halogen Free | |
PCB Thickness | Min. thickness | 0.4mm(16mil) |
Max. thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
Immersion Gold(Silver) | ||
HAL Lead Free | ||
Hot Air Solder Leveling(HASL) | ||
Entek Coating (OSP) | ||
Solder Mask | Green, White, Black, Yellow, Red, Blue | |
Other printing | Gold Finger | |
Carbon Print, Peelable Mask | ||
Solder Mask Plugged Hole | ||
Copper thickness | 1/ 2 oz (18 μ m) - 4 oz (140 μ m) | |
Min. Finished Hole Size | 0.2mm(8mil) | |
Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
Min. Line Width and Spacing | 0.1mm (4 mil) | |
Min. Solder Mask Clearance | 0.05mm (2 mil) | |
Min. Annular Ring | 0.076mm (3mil) | |
Profile and V-Cut | CNC-Routing, Stamping and Beveling, V-CUT, CNC | |
Special Process | Micro-section, Chamfer for Gold Finger | |
File format | Gerber file , CAM350, Protel, PowerPCB | |
E-TEST | Flying Prob , E-test, Fixture | |
Other Test | Impedance , Slice up | |
Warp & Twist | ≤ 0.7% |
Item | Capabilities | |
Number of Layers | From 4-layer to 22- Layer | |
Material | FR-4, HighTg, Rogers Halogen Free | |
PCB Thickness | Min. thickness | 0.4mm(16mil) |
Max. thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
Immersion Gold(Silver) | ||
HAL Lead Free | ||
Hot Air Solder Leveling(HASL) | ||
Entek Coating (OSP) | ||
Solder Mask | Green, White, Black, Yellow, Red, Blue | |
Other printing | Gold Finger | |
Carbon Print, Peelable Mask | ||
Solder Mask Plugged Hole | ||
Copper thickness | 1/ 2 oz (18 μ m) - 4 oz (140 μ m) | |
Min. Finished Hole Size | 0.2mm(8mil) | |
Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
Min. Line Width and Spacing | 0.1mm (4 mil) | |
Min. Solder Mask Clearance | 0.05mm (2 mil) | |
Min. Annular Ring | 0.076mm (3mil) | |
Profile and V-Cut | CNC-Routing, Stamping and Beveling, V-CUT, CNC | |
Special Process | Micro-section, Chamfer for Gold Finger | |
File format | Gerber file , CAM350, Protel, PowerPCB | |
E-TEST | Flying Prob , E-test, Fixture | |
Other Test | Impedance , Slice up | |
Warp & Twist | ≤ 0.7% |