|
Description and Application
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It' s widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
● The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc.and 0.8mm , 1.0mm, 1.5mm, 2.0mm, etc.
● thickness of the copper:18um,35um,70um,105um..
Base size: 500mm × 600mm (20〞×24〞); 600mm × 1060mm (24〞×42〞)
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
The result of the test:
|
Item
|
Test item
|
Technology request
|
Unit
|
Test result
|
|
1
|
Peel Strength
|
A
|
≥1.8
|
N/mm
|
2.0
|
|
After thermal stress(260℃)
|
≥1.8
|
N/mm
|
1.8
|
|
2
|
Blister test AfterThermal stress(260℃，2min)
|
No delaminating
|
/
|
Ok
|
|
3
|
Flammability(A)
|
FV-O
|
/
|
FV-O
|
|
4
|
Thermal resistance
|
≤2.0
|
℃/W
|
1.0
|
|
5
|
Surface Resistivity
|
A
|
≥1×105
|
MΩ
|
5×107
|
|
Constant humidity treatment
(90%,35℃,96h)
|
≥1×105
|
MΩ
|
2×106
|
|
6
|
Volume Resistivity
|
A
|
≥1×106
|
MΩ·m
|
4×108
|
|
Constant humidity treatment
(90%,35℃,96h)
|
≥1×106
|
MΩ·m
|
5×107
|
|
7
|
Dielectric Breakdown(DC)
|
≥28.5
|
Kv/mm
|
31
|
|
8
|
Dielectric constant(1MHz)
(40℃，93%，96h)
|
≤4.4
|
/
|
4.2
|
|
9
|
Dielectric dissipation factor(1MHz)
(40℃，93%，96h)
|
≤0.03
|
/
|
0.02
|
CCAF-04-A Aluminum-base copper-clad laminate
The test base: CCAF-04 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 80um(matrial of the high heat dissipation)
Thickness of the aluminum-base: 1.5mm
The result of the test:
|
Item
|
Test item
|
Technology request
|
Unit
|
Test result
|
|
1
|
Peel Strength
|
A
|
≥1.0
|
N/mm
|
1.05
|
|
After thermal stress(260℃)
|
≥1.0
|
N/mm
|
1.05
|
|
2
|
Blister test AfterThermal stress(288℃，2min)
|
288℃ 2 min
No delaminating
|
/
|
OK
|
|
3
|
Themal Resistance
|
≤2.0
|
℃/W
|
0.65
|
|
4
|
Flammability(A)
|
FV-O
|
/
|
FV-O
|
|
5
|
Surface Resistivity
|
A
|
≥1×105
|
MΩ
|
5.0×107
|
|
Constant humidity treatment
(90%,35℃,96h)
|
≥1×105
|
MΩ
|
4.5×106
|
|
6
7
|
Volume Resistivity
|
A
|
≥1×106
|
MΩ·m
|
1.0×108
|
|
Constant humidity treatment
(90%,35℃,96h)
|
≥1×106
|
MΩ·m
|
1.9×107
|
|
8
|
Dielectric Breakdown(DC)
|
≥25
|
Kv/mm
|
31
|
|
9
|
Dielectric constant(1MHz)
(40℃，93%，96h)
|
≤4.4
|
/
|
4.2
|
|
10
|
Dielectric dissipation factor(1MHz)
(40℃，93%，96h)
|
≤0.03
|
/
|
0.029
|
|
|
Accelerated aging experiment
(125℃，2000h)
|
|
The laminate bace should no wrinkles,no crack,no delaminating or no pine
|
/
|
OK
|
|
11
|
High low temperature impact test
(-50℃，15min，80℃，15minTOTAL DO 15～20 Circulation)
|
Peel Strength
|
/
|
N/mm
|
1.39～1.64
|
|
Surface Resistivity
|
/
|
MΩ
|
1.9×108～6.4×108
|
|
