Item

Capabilities

Number of Layers

From 4-layer to 22- Layer

Material

FR-4,HighTg, Rogers
Halogen Free

PCB Thickness

Min.thickness

0.4mm(16mil)

Max.thickness

3.2mm(128mil)

Surface finished

Gold Plating

Immersion Gold(Silver)

HAL Lead Free

Hot Air Solder Leveling(HASL)

Entek Coating (OSP)

Solder Mask

Green,White,Black,Yellow,Red,Blue

Other printing

Gold Finger

Carbon Print, Peelable Mask

Solder Mask Plugged Hole

Copper thickness

1/2 oz (18 μm) - 4 oz (140 μm)

Min. Finished Hole Size

0.2mm(8mil)

Hole Size Tolerance (PTH)

+/-0.076mm (3 mil)

Hole Size Tolerance (NPTH)

+/-0.05mm (2 mil)

Min. Line Width and Spacing

0.1mm (4 mil)

Min. Solder Mask Clearance

0.05mm (2 mil)

Min. Annular Ring

0.076mm (3mil)

Profile and V-Cut

CNC-Routing, Stamping and Beveling,V-CUT,CNC

Special Process

Micro-section, Chamfer for Gold Finger

   File format

  Gerber file、CAM350、Protel、PowerPCB

   E-TEST

Flying Prob、E-test、  Fixture

  Other Test

  Impedance、  Slice up

 Warp & Twist

 ≤0.7%