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Technical parameters
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Technical parameters
  • NO. ITEM PARAMETERS
    1 Surface Finish HALHAL leadfreeGold PlatingOSPImmersion goldImmersion SilverImmersion Sn and Gold Finger
    2 Layers 1~16 Layers
    3 Base Material FR-4(High Tg,Halogen Free),
    CEM-1, CEM-3,Rogers
    4 Finished Copper Weight 17um-140um
    5 Min Line Width/Space 0.1mm/0.1mm ( 4mil / 4mil )
    6 Min Finished Hole Size 0.2mm(8mil)
    7 NPTH Hole Dia.Tolerance ±0.05mm(2mil)
    8 PTH Hole Dia.Tolerance ±0.075mm(3mil)
    9 Hole Plating Thickness ≥20um
    10 Max Panel Size 500mm X 1200mm
    11 Outline Tolerance ±0.127mm(5mil)
    12 Thickness 0.2~3.2mm
    13 Thickness Tolerance
    (≥0.8mm)
    ±8%
    14 Thickness of Min. Mask 10um
    15 Solder Mask Green, Yellow, Black, Blue, Red, Peelable mask
    16 Min. String Width 0.2mm(8 mil)
    17 Max. String Width 0.8mm(32 mil)
    18 Silkscreen Color Green, Yellow, Black, Blue, Red
    19 File format Gerber file, CAM350, Protel, PowerPCB
    20 E-TEST Flying Prob, E-test, Fixture
    21 Other Test Impedance, Slice up
    22 Warp & Twist ≤0.7%
  •  
    No. Item Capabilities
    1 Layers 1-2 Layers
    2 Finished Thickness 16-134mil (0.4mm-3.4mm )
    3 Max. Dimension 500mm *1200mm
    4 Material TCB-2AL,CS-AL-88/89,EM-MP,HA80,NRK,JHAF02-1.0,3D Bending,Copper base
    5 Finished Thickness Tolerance ≤1.0mm ±0.10mm
    1.6mm ±0.15mm
    6 Min.Line Width&Spacing 4mil (0.1mm )
    7 Copper Thickness 35um, 70um,1 to 10oZ 
    8 Min. Finished Hole Size 0.95mm 
    9 Min. Drill Size 1.00mm 
    10 Max. Drill Size 6.5mm 
    11 Finished Hole Size Tolerance ±0.050mm
    12 Aperture Position Precision ±0.076mm
    13 Warp & Twist 0.75%
    14 Min SMT PAD Size 0.4mm±0.1mm
    15 Min.Solder Mask PAD 0.05mm(2mil)
    16 Min.Solder Mask Cover 0.05mm(2mil)
    17 Solder mask Thickness >12um
    18 Min.Solder Mask Bridge 0.1mm4mil)
    19 Surface Finishing HAL, HAL Leadfree,OSP, Immersion Gold, etc
    20 HAL Thickness 5-12um
    21 Immersion Gold Thickness 1-3 Microinch
    22 OSP Film Thickness ENTEK PLUS HT:0.3-0.5um; F2:0.15-0.3um
    23 V-CUT Angle 30°,45°,60°
    24 V-CUT Thickness 0.4-3.4mm
    25 V-CUT Precision ±0.05mm, Up&Down Cut Deviation
    ±0.05mm,Residual Thickness ±0.05MM
    26 Outline Finishing   Routing & Punching; Precision Deviation ±0.10mm
    27 E-test Voltage 250 ± 5V
    28 E-test Resistance 10Ω-100MΩ
    29 Peel Strength 288°, 30s ≥1.4
    30 Thermal Conductivity 1.0 to 12w/m.k
    31 Withstand Voltage AC:1KV to 6.5KV, DC:1KV to 8.5KV
    32 Thermal Stress 288°,30s Non-Layered No Foaming
     

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